I recently upgraded my computer, specs are as follows:
xfx 6800gs xxx
2*xms 256 2*xms 512
When I first put together the computer I used a DFI infinity nf4ultra. The motherboard came doa. When I got the new mobo and put the comp together I used the thermal pad that came on the stocke heatsink. It was smudged from the previous instalation, some compound was on the cpu, the rest was on the heatsink. Currently I idle at about 35c full load at 44c. I am probably going to overclock in the future so, should I remove the pad and replace it with as5? I have some left over from when I had the 2500+.