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Topic Title: xp-m 2600
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Created On: 07/08/2004 12:00 PM
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 07/08/2004 12:00 PM
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Jae
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Should I use a shim I think I read somewhere to use something else what should I use? I have a Thermalright SLK-947U and a Abit NF7-S mobo 2.0. Please o please help me in the right direction.
 07/08/2004 12:12 PM
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Silk_the_Absent1
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Shims are really a marketing scam. 9 times out of 10 they are too tall, and cause insufficient cpu to heatsink contact. Also, the XP-M 2600+ is a Barton core, and most shims don't work with the larger core area on the Bartons.

-Adam
 07/08/2004 03:48 PM
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Jae
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What should i use? Nothing?
 07/08/2004 03:58 PM
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Greyhound
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Personally, i would advise against using a shim - it doesn't improve cooling and can in some cases prevent the heatsink from making proper contact with the die, which is NOT a good thing...

Just be careful when installing the heatsink and you won't damage the die - it will be easier if you remove the motherboard from the case to install the heatsink.
Also, use some decent thermal compound like Arctic Silver 5 or Arctic Silver Ceramique(preferably ceramique as it is NOT electrically conductive).

Thermal compound should be applied in a very thin layer(about as thin as a sheet of paper) on the die(CPU-core - the small, shiny, metallic thing in the center of your processor) ONLY.

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 07/08/2004 04:19 PM
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Jae
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I have silver 5 is that bad? I really dont wanna fry anything so im gonna ask alot.
 07/08/2004 04:22 PM
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Greyhound
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No, it's actually one of the best thermal compounds out there
It *is* electrically conductive, tho, so be careful and make sure you don't spill any of that stuff on your processor(or anywhere else where it doesn't belong).

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The opinions expressed above do not represent those of Advanced Micro Devices or any of their affiliates.

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AMD Athlon 64 X2 6000+ 89W :: Asus M2N32SLI Deluxe :: 2x1024MB Muskin XP2-6400 DDR2-800 :: BeQuiet! Darkpower Pro 530W :: 2x WD Raptor 74GB/10k rpm, RAID 0 :: ATI Radeon X1950XTX
 07/09/2004 01:01 PM
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MD - Moderator
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AMD changed the packaging of the CPU's to address the "die crush" and "shim" issues when the converted to OPGA, the brown and green part of the cpu, is fiberglass instead of ceramic, that way the is more "give" and less "crunch"...

Does that help

Later

MD

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