I use a basic simple silicon compound in between my XP2400+ core and heatsink base...the same silicon I use in between my power transistor projects and their heatsinks. So can someone orient me further about my use of this thing? Like how many fry-hours before it becomes efficient, exact time to replace again, temperature tolerance, temp to fry...oh yeah how about arctic silver 5 too?

-------------------------
AMD Athlon XP 2500+ Barton overclocked to 3200+ (2.2Ghz with 1.68VCore)
Motherboard: Micro Star International K7N2 Delta2 - Platinum Edition
Memory Modules: 2x256Mb GeIL Value DDR PC3200 (CL=2.5-6-3-3)
Processor Fan: Thermaltake Extreme Volcano 12 with Artic Silver 5
Video Card: Inno3D FX5200 128Mb - 128Bit
<span sty

http://www.arcticsilver.com/instructions.htm' ">http://www.arcticsilver.com/instructions.htm
The tech specs for each compound differ greatly. I say replace it once a year along with a complete cleaning of all components. I take about 25 hot to cold cycles for most compounds to cure.
http://www.dansdata.com/coolercomp.htm' ">http://www.dansdata.com/coolercomp.htm
Some good data in the above link:

-------------------------
( Quote )
Possession of a powerful computer is no substitute for a working brain.
A working brain is no substitute for possession of a powerful computer.