There are 3 different Sempron 64 3200+s: SDA3200DIO3BI, SDA3200DIO3BP, and yours (-BW.) The differences between the different Sempron 64 3200+s would be the stepping. The -BI is the D0 core revision. The -BP is probably E3 and the BW would be E6 and the last socket 939 Sempron 64. The E steppings normally introduced SSE3, but this was left off of the Semprons, so there is really no difference between the three chips.
You can determine your motherboard by searching for the model number (K8NGM2H) or by using a utility like CPU-Z to read stuff from the BIOS. Your motherboard is an OEM version of the MSI K8NGM2. The product page for the K8NGM2H is available here.
"CL" stands for "Column-address-strobe Latency." In laymans's terms, this is how many memory clock cycles that the memory controller must wait between addressing the next column of memory cells in the RAM. Lower is better, and good 512 MB sticks of DDR-400 will be CL2.