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Topic Title: mobile cpu's differences.....?
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Created On: 11/01/2005 08:54 PM
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 11/01/2005 08:54 PM
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iliad2b
Junior Member

Posts: 1
Joined: 08/27/2005

There is three excel charts in this data. simply cut and paste on excel, and you will be able to see the chart, well not a chart but the data that represents the differences between the three mobile solution that amd offers (no semprons).

the first chart offers titles with the terminology that amd has
the second chart gets filter a bit more, and puts together the similar features
the thred chart gets filtered and ambiguous words are assumed to mean similiar features

hope you can make sense of all this, and i kinda did put coloring in it, but obviously you will not be able to see this.

my final analysis is that three processors are the same in the categories that matter the most, so my question is what is the difference between these processors that we as customers are not able to see?

the categories that are the same, and matter the most are:
System Bus Technology
Integrated DDR Memory Controller (MCT)
Processor-to-System Bandwidth
Integrated Northbridge
High-Performance, On-chip Cache
Advanced Power Management
Wireless Compatibility
3D and Multimedia Instructions




First Chart
AMD Turion™ 64 Mobile Technology Mobile AMD Athlon™ 64 Processor AMD Athlon™ 64 Processor
Architecture Introduction 2003 2003 2003
Packaging 754-pin lidless micro- PGA
Thermal Design Power 25W, 35W
Infrastructure Socket 754, lidless uPGA Socket 754, lidless uPGA
Process Technology 90 nanometer, SOI (silicon-on-insulator) technology 2800+ 130 nanometer, 0.13 Micron, SOI
SOI (silicon-on-insulator) technology
3000+, 3200+, 3400+ 3700+
90 nanometer, SOI technology
Number of Transistors 2800+: 105.9 million 105.9 Million
3000+, 3200+, 3400+, 3700+ : 114 million
64-bit Instruction Set Support Yes, Yes,
AMD64 technology AMD64 technology
32-bit Instruction Set Support Yes Yes
Enhanced Virus Protection Capability* Yes
Enhanced Virus Protection for Windows® XP SP2 Yes Yes
System Bus Technology HyperTransport™ technology @ up to 1600MHz HyperTransport™ technology up to 1600MHz HyperTransport™ technology up to 1600MHz
Full duplex Full duplex Full duplex
Integrated Memory Controller (MCT) Yes, 64-bit + 8-bit ECC, supports
PC3200, PC2700, PC2100, or PC1600 so-DIMMs
Integrated DDR Memory Controller (MCT) Yes, Yes,
64-bit + 8-bit ECC 64-bit + 8-bit ECC
PC 3200, PC 2700, PC 2100, or PC1600 SO-DIMMs PC 3200, PC 2700, PC 2100, or PC1600 SO-DIMMs
Processor-to-System Bandwidth HyperTransport technology: up to 6.4 GB/s HyperTransport: up to 6.4 GB/s
Memory controller: up to 3.2 GB/s Memory Controller: up to 3.2GB/s
Total: up to 9.6 GB/s Total: up to 9.6GB/s
Total Processor-to-system Bandwidth System: up to 6.4 GB/s
Memory: up to 3.2 GB/s
Total: up to 9.6GB/s
Integrated Northbridge Yes, Yes, Yes,
128-bit data path @ CPU core frequency 128-bit data path @ CPU core frequency 128-bit data path @ CPU core frequency
High-Performance, On-chip Cache L1: 128KB L1: 128KB
L2: 1024KB (exclusive) L2: 1024KB (exclusive)
Total Effective Cache: 1152KB Total Effective Cache: 1152KB
On-chip L1 Cache (Instruction + Data) 128KB (64KB + 64KB)
On-chip L2 Cache 1024KB/512KB (exclusive)
Total Effective Cache: 1152KB/640KB
Advanced Power Management AMD PowerNow!™ Technology AMD PowerNow!™ Technology AMD PowerNow!™ technology
Wireless Compatibility 802.11a, b, and g 802.11 a, b and g 802.11 a, b and g
3D and Multimedia Instructions 3DNow! ™ Professional technology, SSE2, SSE3 3DNow!™ Professional technology, SSE2, SSE3 3DNow!™ Professional technology, SSE2

Second Chart
AMD Turion™ 64 Mobile Technology Mobile AMD Athlon™ 64 Processor AMD Athlon™ 64 Processor
Architecture Introduction 2003 2003 2003
Thermal Design Power 25W, 35W
Infrastructure/Packaging 754-pin lidless micro- PGA Socket 754, lidless uPGA Socket 754, lidless uPGA
Process Technology 90 nanometer, SOI (silicon-on-insulator) technology 2800+ 130 nanometer, 0.13 Micron, SOI
SOI (silicon-on-insulator) technology
3000+, 3200+, 3400+ 3700+
90 nanometer, SOI technology
Number of Transistors 2800+: 105.9 million 105.9 Million
3000+, 3200+, 3400+, 3700+ : 114 million
64-bit Instruction Set Support Yes, Yes,
AMD64 technology AMD64 technology
32-bit Instruction Set Support Yes Yes
Enhanced Virus Protection for Windows® XP SP2 Yes Yes Yes
System Bus Technology HyperTransport™ technology @ up to 1600MHz HyperTransport™ technology up to 1600MHz HyperTransport™ technology up to 1600MHz
Full duplex Full duplex Full duplex
Integrated DDR Memory Controller (MCT) Yes Yes, Yes,
64-bit + 8-bit ECC, supports 64-bit + 8-bit ECC 64-bit + 8-bit ECC
PC3200, PC2700, PC2100, or PC1600 so-DIMMs PC 3200, PC 2700, PC 2100, or PC1600 SO-DIMMs PC 3200, PC 2700, PC 2100, or PC1600 SO-DIMMs
Processor-to-System Bandwidth System: up to 6.4 GB/s HyperTransport technology: up to 6.4 GB/s HyperTransport: up to 6.4 GB/s
Memory: up to 3.2 GB/s Memory controller: up to 3.2 GB/s Memory Controller: up to 3.2GB/s
Total: up to 9.6GB/s Total: up to 9.6 GB/s Total: up to 9.6GB/s
Integrated Northbridge Yes, Yes, Yes,
128-bit data path @ CPU core frequency 128-bit data path @ CPU core frequency 128-bit data path @ CPU core frequency
High-Performance, On-chip Cache 128KB (64KB + 64KB) L1: 128KB L1: 128KB
1024KB/512KB (exclusive) L2: 1024KB (exclusive) L2: 1024KB (exclusive)
Total Effective Cache: 1152KB/640KB Total Effective Cache: 1152KB Total Effective Cache: 1152KB
Advanced Power Management AMD PowerNow!™ Technology AMD PowerNow!™ Technology AMD PowerNow!™ technology
Wireless Compatibility 802.11a, b, and g 802.11 a, b and g 802.11 a, b and g
3D and Multimedia Instructions 3DNow! ™ Professional technology, SSE2, SSE3 3DNow!™ Professional technology, SSE2, SSE3 3DNow!™ Professional technology, SSE2

Third Chart
AMD Turion™ 64 Mobile Technology Mobile AMD Athlon™ 64 Processor AMD Athlon™ 64 Processor
Architecture Introduction 2003 2003 2003
Thermal Design Power 25W, 35W
Infrastructure/Packaging 754-pin lidless micro- PGA Socket 754, lidless uPGA Socket 754, lidless uPGA
Process Technology 90 nanometer, SOI (silicon-on-insulator) technology 2800+ 130 nanometer, 0.13 Micron, SOI
SOI (silicon-on-insulator) technology
3000+, 3200+, 3400+ 3700+
90 nanometer, SOI technology
Number of Transistors 2800+: 105.9 million 105.9 Million
3000+, 3200+, 3400+, 3700+ : 114 million
64-bit Instruction Set Support Yes, Yes,
AMD64 technology AMD64 technology
32-bit Instruction Set Support Yes Yes
Enhanced Virus Protection for Windows® XP SP2 Yes Yes Yes
System Bus Technology HyperTransport™ technology @ up to 1600MHz HyperTransport™ technology up to 1600MHz HyperTransport™ technology up to 1600MHz
Full duplex Full duplex Full duplex
Integrated DDR Memory Controller (MCT) Yes Yes, Yes,
64-bit + 8-bit ECC, supports 64-bit + 8-bit ECC 64-bit + 8-bit ECC
PC3200, PC2700, PC2100, or PC1600 so-DIMMs PC 3200, PC 2700, PC 2100, or PC1600 SO-DIMMs PC 3200, PC 2700, PC 2100, or PC1600 SO-DIMMs
Processor-to-System Bandwidth System: up to 6.4 GB/s HyperTransport technology: up to 6.4 GB/s HyperTransport: up to 6.4 GB/s
Memory: up to 3.2 GB/s Memory controller: up to 3.2 GB/s Memory Controller: up to 3.2GB/s
Total: up to 9.6GB/s Total: up to 9.6 GB/s Total: up to 9.6GB/s
Integrated Northbridge Yes, Yes, Yes,
128-bit data path @ CPU core frequency 128-bit data path @ CPU core frequency 128-bit data path @ CPU core frequency
High-Performance, On-chip Cache 128KB (64KB + 64KB) L1: 128KB L1: 128KB
1024KB/512KB (exclusive) L2: 1024KB (exclusive) L2: 1024KB (exclusive)
Total Effective Cache: 1152KB/640KB Total Effective Cache: 1152KB Total Effective Cache: 1152KB
Advanced Power Management AMD PowerNow!™ Technology AMD PowerNow!™ Technology AMD PowerNow!™ technology
Wireless Compatibility 802.11a, b, and g 802.11 a, b and g 802.11 a, b and g
3D and Multimedia Instructions 3DNow! ™ Professional technology, SSE2, SSE3 3DNow!™ Professional technology, SSE2, SSE3 3DNow!™ Professional technology, SSE2
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