I just submitted a ticket with drawings (not the best, just jotted them down on post-its) for a CPU that's designed for cooling on over 90% of its surface area. Using similar contact designs as that of a DIMM and not like a PGA or LGA socket.
Through such a design, cooling can be applied to both top/bottom of the CPU. This would allow for better cooling, and better clocking speeds from such small chipsets.
Hoping maybe an engineer will see my ticket and use my design. I'm sure gamers and overclockers like myself would love to use the design for new cooling styles and would allow us to truly push the bounds of overclocking!
990FXA-UD3-Rev1.1 / FX-8350 (OC'd 4.729ghz x8) / Kingston 1600 4x4gig / MSI R9 290X / OCZ Revo Drive 120gig / 2x Western Digital 2T drives in Raid 1 Configuration / OCZ 1000watt PSU / Larkooler 330 Liquid Cooling Kit
06:12 PM by