Topic Title: CPU Design - Better Cooling
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Created On: 01/31/2014 04:21 PM
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 01/31/2014 04:21 PM
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HopnDude
Peon

Posts: 4
Joined: 06/10/2013

I just submitted a ticket with drawings (not the best, just jotted them down on post-its) for a CPU that's designed for cooling on over 90% of its surface area. Using similar contact designs as that of a DIMM and not like a PGA or LGA socket.

Through such a design, cooling can be applied to both top/bottom of the CPU. This would allow for better cooling, and better clocking speeds from such small chipsets.

Hoping maybe an engineer will see my ticket and use my design. I'm sure gamers and overclockers like myself would love to use the design for new cooling styles and would allow us to truly push the bounds of overclocking!



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990FXA-UD3-Rev1.1 / FX-8350 (OC'd 4.729ghz x8) / Kingston 1600 4x4gig / MSI R9 290X / OCZ Revo Drive 120gig / 2x Western Digital 2T drives in Raid 1 Configuration / OCZ 1000watt PSU / Larkooler 330 Liquid Cooling Kit



Edited: 01/31/2014 at 06:12 PM by HopnDude
 02/02/2014 09:00 AM
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Vegan
Elite

Posts: 1232
Joined: 01/31/2010

This design of a cooling surface on one side of the CPU package is needed as the other side has all signals.

 

The actual die is small, but there is a lot of other materials inside to manage heat.



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 02/03/2014 12:19 PM
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HopnDude
Peon

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Joined: 06/10/2013

Originally posted by: Vegan This design of a cooling surface on one side of the CPU package is needed as the other side has all signals.

The actual die is small, but there is a lot of other materials inside to manage heat.

So can the signals (in/out) not be navigated to the edges of the CPU? So that a new material could used to allow for cooling to be applied to both top/bottom of the CPU.

I just don't feel that cooling the CPU from < 50% of it's surface area is very efficient for cooling. If cooling can be applied to > 50% (around 90%) of the surface area, more heat could be dissipated from the CPU, and allow for smaller CPU circuitry design as heat wouldn't be able to harm the smaller internal circuitry because of better cooling.

 



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990FXA-UD3-Rev1.1 / FX-8350 (OC'd 4.729ghz x8) / Kingston 1600 4x4gig / MSI R9 290X / OCZ Revo Drive 120gig / 2x Western Digital 2T drives in Raid 1 Configuration / OCZ 1000watt PSU / Larkooler 330 Liquid Cooling Kit

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